Resin for transparent encapsulation material, and associated encapsulation material and electronic device

ABSTRACT

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.

BACKGROUND

1. Field

Embodiments relate to a resin for a transparent encapsulation material,and an associated encapsulation material and electronic device.

2. Description of the Related Art

A light emitting element, such as a light emitting diode (LED), anorganic light emitting device (OLED), a photoluminescent (PL) device,and the like, may be variously applied to a domestic electric device, alighting device, a display device, various automatic devices, and thelike. In some cases, the light emitting element may display intrinsiccolors of a light emitting material such as blue, red, and green using alight emitter, or white by combining light emitters displaying differentcolors. In other cases, an electronic device may receive light.

SUMMARY

An embodiment is directed to a resin for an encapsulation material, theresin including a first polysiloxane including hydrogen bound to silicon(Si—H) at its terminal end, and a second polysiloxane including analkenyl group bound to silicon (Si—Vi) at its terminal end. A ratio(Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the firstpolysiloxane to the alkenyl group bound to silicon (Si—Vi) in the secondpolysiloxane may be about 1 to about 1.2.

The ratio (Si—H/Si—Vi) may be about 1.05 to about 1.15.

The first polysiloxane may be represented by the following ChemicalFormula 1:(R₁R₂R₃SiO_(1/2))_(M1)(R₄R₅SiO_(2/2))_(D1)(R₆SiO_(3/2))_(T1)(SiO_(4/2))_(Q1)  [ChemicalFormula 1]In Chemical Formula 1, R₁ to R₆ may each independently be hydrogen, asubstituted or unsubstituted C1 to C30 alkyl group, a substituted orunsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstitutedC6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkylgroup, a substituted or unsubstituted C1 to C30 heteroalkyl group, asubstituted or unsubstituted C2 to C30 heterocycloalkyl group, asubstituted or unsubstituted C2 to C30 alkynyl group, a substituted orunsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1to C30 carbonyl group, a hydroxy group, or a combination thereof,provided that at least one of R₁ to R₆ is hydrogen, and the Formula maysatisfy 0<M1<1, 0<D1<1, 0≦T1<1, 0≦Q1<1, and M1+D1+T1+Q1=1.

The second polysiloxane may be represented by the following ChemicalFormula 2:(R₇R₈R₉SiO_(1/2))_(M2)(R₁₀R₁₁SiO_(2/2))_(D2)(R₁₂SiO_(3/2))_(T2)(SiO_(4/2))_(Q2)  [ChemicalFormula 2]In Chemical Formula 2, R₇ to R₁₂ may each independently be a substitutedor unsubstituted C1 to C30 alkyl group, a substituted or unsubstitutedC3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, asubstituted or unsubstituted C1 to C30 heteroalkyl group, a substitutedor unsubstituted C2 to C30 heterocycloalkyl group, a substituted orunsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxygroup, a substituted or unsubstituted C1 to C30 carbonyl group, ahydroxy group, or a combination thereof, provided that at least one ofR₇ to R₁₂ includes the substituted or unsubstituted C2 to C30 alkenylgroup, and the Formula may satisfy 0<M2<1, 0<D2<1, 0<T2<1, 0≦Q2<1, andM2+D2+T2+Q2=1.

The first polysiloxane may be represented by the following ChemicalFormula 1:(R₁R₂R₃SiO_(1/2))_(M1)(R₄R₅SiO_(2/2))_(D1)(R₆SiO_(3/2))_(T1)(SiO_(4/2))_(Q1)  [ChemicalFormula 1]In Chemical Formula 1, R₁ to R₆ may each independently be hydrogen, asubstituted or unsubstituted C1 to C30 alkyl group, a substituted orunsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstitutedC6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkylgroup, a substituted or unsubstituted C1 to C30 heteroalkyl group, asubstituted or unsubstituted C2 to C30 heterocycloalkyl group, asubstituted or unsubstituted C2 to C30 alkynyl group, a substituted orunsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1to C30 carbonyl group, a hydroxy group, or a combination thereof,provided that at least one of R₁ to R₆ is hydrogen, and the Formula maysatisfy 0<M1<1, 0<D1<1, 0≦T1<1, 0≦Q1<1, and M1+D1+T1+Q1=1.

The first polysiloxane may be included in an amount of less than about50 wt % based on the total amount of the resin, and the secondpolysiloxane may be included in an amount of more than about 50 wt %based on the total amount of the resin.

The second polysiloxane may be included in an amount of about 65 wt % toabout 99 wt % based on the total amount of resin.

The first polysiloxane may have a weight average molecular weight ofabout 100 g/mol to about 10,000 g/mol.

The first polysiloxane may have a weight average molecular weight ofabout 100 g/mol to about 3,000 g/mol.

The second polysiloxane may have a weight average molecular weight ofabout 1,000 g/mol to about 100,000 g/mol.

The second polysiloxane may have a weight average molecular weight ofabout 1,000 g/mol to 20,000 g/mol.

The resin may further include a hydrosilation catalyst.

Another embodiment is directed to a transparent encapsulation materialprepared by curing the resin according to an embodiment.

The encapsulation material may exhibit a light transmittance (T) ofabout 80% to about 100%.

The encapsulation material may exhibit a light transmittance decreaseratio (ΔT) of less than about 15% after heating at about 120° C. forabout 500 hours.

The encapsulation material may exhibit a light transmittance decreaseratio (ΔT) of less than about 15% after heating at about 180° C. forabout 150 hours.

The encapsulation material may exhibit a tackiness of less than about100 kgf.

Another embodiment is directed to an electronic device including atransparent encapsulation material according to an embodiment.

The electronic device may include one or more of a light emitting diode,an organic light emitting device, a photo luminescent device, and asolar cell.

Another embodiment is directed to a method of manufacturing anelectronic device, including providing an element that receives and/oremits light, the element including one or more of a light emittingdiode, an organic light emitting device, a photo luminescent device, anda solar cell, at least partially covering the element with a resin, andcuring the resin to form a transparent material, wherein the resin is aresin according to an embodiment.

DETAILED DESCRIPTION

Korean Patent Applications No. 10-2010-0140560 and 10-2011-0142972,filed on Dec. 31, 2010 and Dec. 27, 2011, respectively, in the KoreanIntellectual Property Office, and entitled: “Transparent Resin forEncapsulation material And Encapsulation Material And Electronic DeviceIncluding The Same,” are incorporated by reference herein in theirentireties.

Example embodiments will now be described more fully hereinafter;however, they may be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art.

As used herein, when a definition is not otherwise provided, the term“substituted” may refer to one substituted with at least a substituentselected from the group of a halogen (F, Br, Cl, or I), a hydroxy group,an alkoxy group, a nitro group, a cyano group, an amino group, an azidogroup, an amidino group, a hydrazino group, a hydrazono group, acarbonyl group, a carbamyl group, a thiol group, an ester group, acarboxyl group or a salt thereof, a sulfonic acid group or a saltthereof, a phosphoric acid group or a salt thereof, a C1 to C30 alkylgroup, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30aryl group, a C7 to C30 arylalkyl group, a C1 to C30 alkoxy group, a C1to C20 heteroalkyl group, a C3 to C20 heteroarylalkyl group, a C3 to C30cycloalkyl group, a C3 to C15 cycloalkenyl group, a C6 to C15cycloalkynyl group, a C3 to C30 heterocycloalkyl group, and acombination thereof, instead of hydrogen of a compound.

As used herein, when a definition is not otherwise provided, the prefix“hetero” may refer to one including 1 to 3 heteroatoms selected from N,O, S, and P.

Hereinafter, a resin for a transparent encapsulation material accordingto an example embodiment is described.

The resin for a transparent encapsulation material according to anexample embodiment includes a first polysiloxane including hydrogenbound to silicon (Si—H) at its terminal end, and includes a secondpolysiloxane including an alkenyl group bound to silicon (Si—Vi) at itsterminal end.

The first polysiloxane may be represented by the following ChemicalFormula 1.(R₁R₂R₃SiO_(1/2))_(M1)(R₄R₅SiO_(2/2))_(D1)(R₆SiO_(3/2))_(T1)(SiO_(4/2))_(Q1)  [ChemicalFormula 1]

In Chemical Formula 1, R₁ to R₆ may each independently be hydrogen, asubstituted or unsubstituted C1 to C30 alkyl group, a substituted orunsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstitutedC6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkylgroup, a substituted or unsubstituted C1 to C30 heteroalkyl group, asubstituted or unsubstituted C2 to C30 heterocycloalkyl group, asubstituted or unsubstituted C2 to C30 alkynyl group, a substituted orunsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1to C30 carbonyl group, a hydroxy group, or a combination thereof, whereat least one of R₁ to R₆ may be hydrogen. Chemical Formula 1 may satisfythe relations 0<M1<1, 0<D1<1, 0≦T1<1, 0≦Q1<1, and M1+D1+T1+Q1=1, whereM1, D1, T1, and Q1 denote each mole ratio.

The second polysiloxane may be represented by the following ChemicalFormula 2.(R₇R₈R₉SiO_(1/2))_(M2)(R₁₀R₁₁SiO_(2/2))_(D2)(R₁₂SiO_(3/2))_(T2)(SiO_(4/2))_(Q2)  [ChemicalFormula 2]

In Chemical Formula 2, R₇ to R₁₂ may each independently be a substitutedor unsubstituted C1 to C30 alkyl group, a substituted or unsubstitutedC3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, asubstituted or unsubstituted C1 to C30 heteroalkyl group, a substitutedor unsubstituted C2 to C30 heterocycloalkyl group, a substituted orunsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxygroup, a substituted or unsubstituted C1 to C30 carbonyl group, ahydroxy group, or a combination thereof, where at least one of R₇ to R₁₂may be a substituted or unsubstituted C2 to C30 alkenyl group. ChemicalFormula 2 may satisfy the relations 0<M2<1, 0<D2<1, 0<T2<1, 0≦Q2<1, andM2+D2+T2+Q2=1, where M2, D2, T2, and Q2 denote each mole ratio.

A cross-linking bond and curing degree of the resin may be controlled byincluding both the first polysiloxane (including hydrogen bound tosilicon (Si—H) at its terminal end) and the second polysiloxane (havingan alkenyl group bound to silicon (Si—Vi) at its terminal end). Theresin may have a ratio (Si—H/Si—Vi) of the hydrogen bound to silicon(Si—H) to the alkenyl group bound to silicon (Si—Vi) of about 1 to 1.2.The ratio (Si—H/Si—Vi) (representing the ratio of the hydrogen bound tosilicon (Si—H) to the alkenyl group bound to silicon (Si—Vi)) may beabout 1.05 to 1.15, for example, about 1.10.

Including the hydrogen bound to silicon (Si—H) and the alkenyl groupbound to silicon (Si—Vi) at a ratio (Si—H/Si—Vi) within the range mayimprove the heat resistance and tackiness, as well as maintain the lighttransmittance of the cured resin.

In an example embodiment, the resin having the ratio (Si—H/Si—Vi) ofhydrogen bound to silicon (Si—H) to the alkenyl group bound to silicon(Si—Vi) within the range may have a light transmittance of about 80% toabout 100% with reference to a wavelength of about 450 nm after curing,and may have a light transmittance decrease ratio (ΔT) (described below)of less than about 15% even when exposed at a high temperature for along time. Thus, the resin may ensure the heat resistance, so it mayprevent a significant deterioration of light transmittance due toyellowing, even when exposed to a high temperature for a long time.

In addition, the resin having the ratio (Si—H/Si—Vi) of hydrogen boundto silicon (Si—H) to the alkenyl group bound to silicon (Si—Vi) withinthe range may have a tackiness of less than about 100 kgf after curing.The tackiness refers to the tacking degree on the surface of curedresin. When the tackiness is strong, it may cause process difficultiesif adjacent encapsulation materials are tacked to each other duringpreparing the encapsulation material provided by curing the resin.

In the resin including alkenyl group bound to silicon (Si—Vi) at itsterminal end and a first polysiloxane including hydrogen bound tosilicon (Si—H) at its terminal end according to an embodiment, the heatresistance and tackiness may be significantly improved by controllingthe ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) and thealkenyl group bound to silicon (Si—Vi) within the range.

The first polysiloxane may have a weight average molecular weight ofabout 100 g/mol to about 10,000 g/mol, for example about 100 g/mol toabout 3,000 g/mol.

The first polysiloxane may be included in an amount of less than about50 wt %, for example, about 1 to about 35 wt %, based on the totalamount of resin.

The second polysiloxane have a weight average molecular weight of about1,000 g/mol to about 100,000 g/mol, and specifically about 1,000 g/molto about 20,000 g/mol.

The second polysiloxane may be included in an amount of more than about50 wt %, for example, about 65 wt % to about 99 wt %, based on the totalamount of resin.

With the first polysiloxane and the second polysiloxane within the rangeof the weight average molecular weight and the amounts, respectively,the reactivity of the resin may be controlled.

The resin may further include a hydrosilation catalyst. Thehydrosilation catalyst may accelerate the hydrosilation reaction betweenhydrogen bound to silicon (Si—H) parts of the first polysiloxane and thealkenyl group bound to silicon (Si—Vi) parts of the second polysiloxane,and it may include, for example, one or more of platinum, rhodium,palladium, ruthenium, iridium, etc. The hydrosilation catalyst may beused to promote a hydrosilation reaction between the Si—H moiety of thefirst polysiloxane and the unsaturated bond of the alkenyl of the Si—Vimoiety of the second polysiloxane.

The hydrosilation catalyst may be included in an amount of about 0.1 ppmto about 1,000 ppm based on the total amount of the resin.

The resin may further include a catalyst inhibitor. The catalystinhibitor may be included in an amount of about 0.001 wt % to about 1 wt%, based on the total amount of resin.

The resin may further include an adhesion promoter. The adhesionpromoter may include, for example, one or more ofglycidoxypropyltrimethoxysilane, vinyltriethoxysilane,glycidoxypropyltriethoxysilane, etc.

The resin may be cured to be used as a transparent encapsulationmaterial of an electronic device. For example, the curing may beperformed by coating the resin on a substrate with a thickness of about0.01 mm to 3 mm, and then heat-treating the coated resin at atemperature of about 100 to 300° C. for about 1 to 10 hours. Theelectronic device may include, for example, one or more of a lightemitting diode, an organic light emitting device, a photo luminescentdevice, a solar cell, etc.

The encapsulation material made with the resin according to anembodiment may resist a yellowing phenomenon or deterioration, e.g.,when exposed at a high temperature for a long time. The encapsulationmaterial made with the resin according to an embodiment may exhibit ahigh light transmittance, which may help the heat resistance. Theencapsulation material made with the resin according to an embodimentmay improve processibility due to a low tackiness.

The following Examples and Comparative Examples are provided in order toset forth particular details of one or more embodiments. However, itwill be understood that the embodiments are not limited to theparticular details described. Further, the Comparative Examples are setforth to highlight certain characteristics of certain embodiments, andare not to be construed as either limiting the scope of the invention asexemplified in the Examples or as necessarily being outside the scope ofthe invention in every respect.

Synthesis of First Polysiloxane

Water and toluene were mixed in a weight ratio 5:5 to prepare a mixedsolvent. 1 kg of the mixed solvent was put into a 3-necked flask, anddiphenyl dichlorosilane and tetramethyldisiloxane with a mole ratio of40:60 were added dropwise thereto, while the flask was maintained at 23°C. When the dropwise addition was complete, the mixture was heated andrefluxed to perform a condensation polymerization reaction at 50° C. for3 hours. The resulting reactant was cooled down to room temperature, anda water layer therein was removed, preparing a solution in which apolymer was dissolved in toluene. The polymer solution was cleaned withwater to remove chlorine, a reaction byproduct. Then, the neutralizedpolymer solution was distilled under reduced pressure to remove toluene,preparing liquid polysiloxane.

The polysiloxane was measured regarding weight average molecular weightthrough gel permeation chromatography and the molecular weight reducedto polystyrene was determined to be 750 g/mol. The polysiloxane wasidentified to have a structure of Chemical Formula A using H-NMR,Si—NMR, and element analyzer. Herein, “Me” indicates a methyl group,“Ph” indicates a phenyl group, “Si” indicates silicon, and “H” indicateshydrogen.(Me₂HSiO_(1/2))₂(Ph₂SiO_(2/2))  [Chemical Formula A]

Synthesis of Second Polysiloxane

1 kg of a mixed solvent prepared by mixing water and toluene at a weightratio of 5:5 was put into a 3-neck flask and then, allowed to stand at23° C. Subsequently, phenyltrichlorosilane, phenylmethyldichlorosilane,and vinyldimethylchlorosilane were mixed with a mole ratio 27:55:18. Themixture was heated and refluxed to perform a condensation polymerizationreaction at 90° C. for 3 hours. The resulting reactant was cooled downto room temperature, and a water layer therein was removed, preparing asolution in which a polymer was dissolved in toluene. The polymersolution was cleaned with water to remove chlorine, a reactionbyproduct. Subsequently, the neutralized polymer solution was distilledunder a reduced pressure to remove toluene and obtain liquidpolysiloxane.

The obtained polysiloxane was measured regarding weight averagemolecular weight through a gel permeation chromatography, and wasdetermined to have a molecular weight reduced to polystyrene of 2,500g/mol. The polysiloxane was determined to have a structure representedby Chemical Formula B using H-NMR, Si—NMR, and an element analyzer.Herein, “Me” indicates a methyl group; “Ph” indicates a phenyl group;“Vi” indicates a vinyl group; and “Si” indicates silicon.(Me₂ViSiO_(1/2))_(0.13)(PhSiO_(3/2))_(0.3)(PhMeSiO_(2/2))_(0.57)  [ChemicalFormula B]

Preparation of Resin Example 1

13.6 wt % of the first polysiloxane represented by the Chemical FormulaA and 86.4 wt % of the second polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) as hydrosilation catalyst to provide a Pt amount of 2 ppm.Further, 0.002 wt % of Surfynol (manufactured by TCI) as a catalystinhibitor was added thereto. The silicon-hydrogen bond (Si—H) and thesilicon-alkenyl group bond (Si—Vi) were present at a ratio (Si—H/Si—Vi)of about 1.00.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated at 150° C. for 2 hours and cured to provide a cured specimen.

Example 2

14.2 wt % of the first polysiloxane represented by the Chemical FormulaA and 85.8 wt % of the second polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) to provide a Pt amount of 2 ppm. Further, 0.002 wt % ofSurfynol (manufactured by TCI) as a catalyst inhibitor was addedthereto. The silicon-hydrogen bond (Si—H) and the silicon-alkenyl groupbond (Si—Vi) were present at a ratio (Si—H/Si—Vi) of about 1.05.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated at 150° C. for 2 hours and cured to provide a cured specimen.

Example 3

14.8 wt % of the first polysiloxane represented by the Chemical FormulaA and 85.2 wt % of the first polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) to provide a Pt amount of 2 ppm. Further, 0.002 wt % ofSurfynol (manufactured by TCI) as a catalyst inhibitor was addedthereto. The silicon-hydrogen bond (Si—H) and the silicon-alkenyl groupbond (Si—Vi) were present at a ratio (Si—H/Si—Vi) of about 1.10.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated at 150° C. for 2 hours and cured to provide a cured specimen.

Example 4

15.3 wt % of the first polysiloxane represented by the Chemical FormulaA and 84.7 wt % of the second polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) to provide a Pt amount of 2 ppm. Further, 0.002 wt % ofSurfynol (manufactured by TCI) as a catalyst inhibitor was addedthereto. The silicon-hydrogen bond (Si—H) and the silicon-alkenyl groupbond (Si—Vi) were present at a ratio (Si—H/Si—Vi) of about 1.15.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated and cured at 150° C. for 2 hours to provide a cured specimen.

Example 5

15.9 wt % of the first polysiloxane represented by the Chemical FormulaA and 84.1 wt % of the second polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) to provide a Pt amount of 2 ppm. Further, 0.002 wt % ofSurfynol (manufactured by TCI) as a catalyst inhibitor was addedthereto. The silicon-hydrogen bond (Si—H) and the silicon-alkenyl groupbond (Si—Vi) were present at a ratio (Si—H/Si—Vi) of about 1.20.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated and cured at 150° C. for 2 hours to provide a cured specimen.

Comparative Example 1

11.2 wt % of the first polysiloxane represented by the Chemical FormulaA and 88.8 wt % of the second polysiloxane represented by the ChemicalFormula B were mixed and added with PS-CS-2.0CS (manufactured byUnicore) to provide a Pt amount of 2 ppm. Further, 0.002 wt % ofSurfynol (manufactured by TCI) as a catalyst inhibitor was addedthereto. The silicon-hydrogen bond (Si—H) and the silicon-alkenyl groupbond (Si—Vi) were present at a ratio (Si—H/Si—Vi) of about 0.8.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated and cured at 150° C. for 2 hours to provide a cured specimen.

Comparative Example 2

19.1 wt % of the first polysiloxane represented by the Chemical FormulaA and 80.9 wt % of the second polysiloxane represented by the ChemicalFormula were mixed and added with PS-CS-2.0CS (manufactured by Unicore)to provide a Pt amount of 2 ppm. Further, 0.002 wt % of Surfynol(manufactured by TCI) as a catalyst inhibitor was added thereto. Thesilicon-hydrogen bond (Si—H) and the silicon-alkenyl group bond (Si—Vi)were present at a ratio (Si—H/Si—Vi) of about 15.00.

The mixed solution was coated on a substrate in a thickness of 1 mm, andheated and cured at 150° C. for 2 hours to provide a cured specimen.

Evaluation—1

Each cured resin obtained from Examples 1 to 5 and Comparative Example 1and 2 was measured for initial light transmittance and heat resistance.

The initial light transmittance was determined by measuring the curedresin at a wavelength of 450 nm using a UV-spectrophotometer (Shimadzu,UV-3600).

The heat resistance was determined by heating the cured resin at 120° C.for 1,000 hours and measuring light transmittance according to the samemethod.

The results are described with reference to Table 1.

TABLE 1 Comp. Comp. Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 1 Ex. 2 Initiallight 97.0 96.9 97.3 97.2 97.5 97.2 97.1 transmittance (%) Light 88.392.2 96.0 91.1 85.3 75.5 76.6 transmission after heating (%) Light 8.74.7 1.3 6.1 12.2 21.7 20.5 transmission decrease ratio (%)

Referring to Table 1, the cured resins of Examples 1 to 5 according toexample embodiments had a transmittance difference between the initialtransmittance and the transmittance after heating at 120° C. for 500hours (i.e., a light transmission decrease ratio ΔT) within about 15%.In addition, the cured resins of Examples 2, 3, and 4 according toexample embodiments had excellent transmission decrease ratios, whichwere about 7% or less. In addition, the cured resin of Example 3according to an example embodiment had the best transmission decreaseratio, which was about 1.3%.

On the other hand, the cured resin according to Comparative Example 1and 2 had a light transmittance decrease ratio of about 20% or moreafter heating at 120° C. for 500 hours.

From the results, it is confirmed that the resins of Examples 1 to 5provided improved heat resistance.

Evaluation—2

The cured resins according to Examples 1 to 5 and Comparative Example 1and 2 were measured for the heat resistance again under a highertemperature condition.

The initial light transmittance was measured in accordance with the sameprocedure as in above.

The heat resistance was determined by measuring the light transmittanceaccording to the same method after heating the cured resin at 180° C.for 150 hours.

The results are described with reference to Table 2.

TABLE 2 Comp. Comp. Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 1 Ex. 2 Initiallight 97.0 96.9 97.3 97.2 97.5 97.2 97.1 transmittance (%) Light 85.691.0 95.4 90.2 83.9 73.5 74.1 transmittance (%) Light 11.4 5.9 1.9 7.013.6 23.7 23.0 transmittance decrease ratio (%)

Referring to Table 2, the cured resins of Examples 1 to 5 according toexample embodiments had a transmittance difference (between the initialtransmittance and the transmittance after heating at 180° C. for 150hours) within about 15%. In addition, the cured resins of Examples 2, 3,and 4 according to example embodiments had better transmittance decreaseratios, which were about 7% or less. In addition, the cured resin ofExample 3 according to an example embodiment had the best transmissiondecrease ratio, which was of about 1.9%.

On the other hand, the cured resin according to Comparative Example 1and 2 had a light transmittance decrease ratio of about 23% afterheating at 180° C. for 150 hours.

From the results, it is confirmed that the resins of Examples 1 to 5provided improved heat resistance.

Evaluation—3

The cured resins according to Examples 1 to 5 and Comparative Example 1and 2 were measured for tackiness.

The tackiness was determined by applying a constant load to the curedresin using TopTac 2000A, and measuring the force during detaching thesame.

The details are the below:

-   -   Device: TopTac 2000A    -   Test Zig: 1 inch Half Ball, SS, Compressive Load 300.00 gf    -   Test Velocity: Target Displacement 10.00 mm        -   prop 0.08 mm/sec        -   Dwell 300 gf, 10 sec        -   Rise 0.1 mm/sec

The results are described with reference to Table 3.

TABLE 3 Comp. Comp. Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 1 Ex. 2 Tackiness93 33 21 25 86 180 120 (kgf)

Referring to Table 3, the cured resins of Examples 1 to 5 according toexample embodiments had a tackiness of about 100 kgf or less, which issatisfactory. In addition, the resins of Example 2, 3, and 4 accordingto example embodiments provided remarkably low tackiness, and the resinaccording to Example 3 provided the lowest tackiness of about 21 kgf.

On the other hand, the resin according to Comparative Example 1 and 2provided the highest tackiness.

From the results, it is confirmed that the resins according to Examples1 to 5 provided significantly improved tackiness.

From the results, it can be understood that the heat resistance andtackiness were significantly improved by using a resin according toexample embodiments, the resin having the ratio (Si—H/Si—Vi) ofsilicon-hydrogen bond (Si—H) to silicon-alkenyl group bond (Si—Vi) ofthe first polysiloxane and the second polysiloxane within the statedrange.

By way of summation and review, a light emitting element may generallyhave a packaging or encapsulation structure. The packaging orencapsulation structure may be made of a transparent encapsulationmaterial being able to externally pass light emitted from a lightemitter. Similarly, an electronic device such as a solar cell may bepackaged or encapsulated with a transparent encapsulation material thatis able to pass light, e.g., sun light. The encapsulant may bepositioned in a place where light is passed, and thus characteristicssuch as transmittance and heat resistance of the encapsulant may affectthe light efficiency of the device. In addition, the transparentencapsulant may be provided in a structure covering a light emitter, soas to be disposed on the surface of light emitting element, wherein itmay be exposed.

An embodiment may provide a resin for a transparent encapsulationmaterial that enhances the processibility as well as prevents thedeterioration of light efficiency by improving the physical property ofresin. Another embodiment may provide an encapsulation materialincluding the resin. Another embodiment may provide an electronic deviceincluding the encapsulation material. In the encapsulation material,heat resistance and tackiness may be significantly improved.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A resin for an encapsulation material, the resin comprising: a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, and an adhesion promoter, wherein: a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.2; the resin being curable to form an encapsulation material that exhibits a light transmittance (T) of about 80% to about 100%, and the second polysiloxane is represented by the following Chemical Formula 2: (R₇R₈R₉SiO_(1/2))_(M2)(R₁₀R₁₁SiO_(2/2))_(D2)(R₁₂SiO_(3/2))_(T2)(SiO_(4/2))_(Q2)  [Chemical Formula 2] wherein, in Chemical Formula 2, R₇ to R₁₂ are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof, provided that at least one of R₇ to R₁₂ includes the substituted or unsubstituted C2 to C30 alkenyl group, 0<M2<1,0<D2<1,0<T2<1,0≦Q2<1, and M2+D2+T2+Q2=1.
 2. The resin as claimed in claim 1, wherein the ratio (Si—H/Si—Vi) is about 1.05 to about 1.15.
 3. The resin as claimed in claim 1, wherein the first polysiloxane is represented by the following Chemical Formula 1: (R₁R₂R₃SiO_(1/2))_(M1)(R₄R₅SiO_(2/2))_(D1)(R₆SiO_(3/2))_(T1)(SiO_(4/2))_(Q1)  [Chemical Formula 1] wherein, in Chemical Formula 1, R₁ to R₆ are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof, provided that at least one of R₁ to R₆ is hydrogen, 0<M1<1,0<D1<1,0≦T1<1,0≦Q1<1, and M1+D1+T1+Q1=1.
 4. The resin as claimed in claim 1, wherein: the first polysiloxane is included in an amount of less than about 50 wt % based on the total amount of the resin, and the second polysiloxane is included in an amount of more than about 50 wt % based on the total amount of the resin.
 5. The resin as claimed in claim 4, wherein the second polysiloxane is included in an amount of about 65 wt % to about 99 wt % based on the total amount of resin.
 6. The resin as claimed in claim 1, wherein the first polysiloxane has a weight average molecular weight of about 100 g/mol to about 10,000 g/mol.
 7. The resin as claimed in claim 6, wherein the first polysiloxane has a weight average molecular weight of about 100 g/mol to about 3,000 g/mol.
 8. The resin as claimed in claim 1, wherein the second polysiloxane has a weight average molecular weight of about 1,000 g/mol to about 100,000 g/mol.
 9. The resin as claimed in claim 8, wherein the second polysiloxane has a weight average molecular weight of about 1,000 g/mol to 20,000 g/mol.
 10. The resin as claimed in claim 1, further comprising a hydrosilation catalyst.
 11. A transparent encapsulation material prepared by curing the resin of claim
 1. 12. The encapsulation material as claimed in claim 11, wherein the encapsulation material exhibits a light transmittance decrease ratio (ΔT) of less than about 15% after heating at about 120° C. for about 500 hours.
 13. The encapsulation material as claimed in claim 11, wherein the encapsulation material exhibits a light transmittance decrease ratio (ΔT) of less than about 15% after heating at about 180° C. for about 150 hours.
 14. The encapsulation material as claimed in claim 11, wherein the encapsulation material exhibits a tackiness of less than about 100 kgf.
 15. An electronic device comprising the transparent encapsulation material of claim
 11. 16. The electronic device as claimed in claim 15, wherein the electronic device includes one or more of a light emitting diode, an organic light emitting device, a photo luminescent device, and a solar cell.
 17. A method of manufacturing an electronic device, the method comprising: providing an element that receives and/or emits light, the element including one or more of a light emitting diode, an organic light emitting device, a photo luminescent device, and a solar cell; at least partially covering the element with a resin; and curing the resin to form a transparent material; wherein the resin includes: a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, and an adhesion promoter, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.2; the resin being curable to form an encapsulation material that exhibits a light transmittance (T) of about 80% to about 100%. 